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| PAGE UNDER CONSTRUCTION ! | |
| Applications: | |
| - 300 mm wafer processing | |
| - die bonders and die sorters | |
| - SMT advanced packaging systems | |
| - wafer inspection | |
| - pharmaceutical packaging | |
| - laboratory automation | |
| - automated assembly | |
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"X -Theta" configuration |
"X-Y-Theta" configuration |
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Complete 8" and 12" Wafer Presentation Systems for die bonders, die sorters, SMT advanced packaging equipment |
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